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Software

Software, Software Engineering Programming, soho Software, Insulating layer of SOI wafers

Software
Software, data or programs collectively.

Software Engineering Programming
Software engineering, specializing in software development process and methods of discipline, covering computer technology, and management of two parts.

soho Software
Page (SOHO) has not yet completed finishing.

Insulating layer of SOI wafers
Through a unique "insulation" (blanket of insulation), developed by the "insulating layer chip" process will be able to protect the chip, millions of transistors, and reduce some harmful electrical effects, electrical effects of these will likely make chips consume too much power, or reduce their computing performance. Semiconductor manufacturers will be able to use the new developed "insulating layer chip" process technology, mass production of a variety of high-performance, low power consumption chips.
In addition, the use of "insulating layer chip" technology to produce a low power consumption of the chip, its power there was only one-third of the current components; This is a very important development, because by reducing chip power consumption will be within the handheld device to extend battery life, such as mobile phones, notebook computers, personal digital assistants, as well as the possible future of a variety of information systems.
IBM R & D firms are expected to be "insulating layer chip" technology for a variety of semiconductor components, including application-specific chips, standard function components (such as the PowerPC microprocessors), as well as S/390, AS/400, and RS/6000 series used in the semiconductor device inside.
However, "insulating layer chip" Although so far the development of the semiconductor manufacturing process for some time, but because of technical obstacles, making it in the production of a huge amount of mainstream chip applications, has been very difficult and expensive.

 
 
 



 
 
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