The tip/chip package technology where the Intel corporation is in the midst of developing. The package itself is produced with the technique which is similar to the processor core, the technique that is taken the core is imbedded inside the package. Because wiring becomes short in comparison with the package by present soldering, high speed and exchanging the data which is stabilized becomes possible, it is possible to assure the decrease of high clock conversion and drive voltage. As for the utilization of BBUL around
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